Flexible lead bonding apparatus

作者: Thomas L. Angelucci , Joseph L. Angelucci

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摘要: An apparatus for bonding the flexible leads of a sprocketed lead frame tape to terminals an integrated circuit device is provided with movable index station, anvil means and vertically moving tool. The on are automatically positioned by indexing station relative tool extreme final accuracy. be bonded may manually or said align tool, in axial alignment.

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