Method for creating substrate electrodes for flip chip and other applications
作者： Thomas R. Pian , Samuel Reele
DOI:
关键词:
摘要: A method and apparatus for forming a conductive bump on metal or other surface layer. substrate is provided which includes the surface, passivation layer next to an etch stop The layers have via therethrough exposes portion of surface. At least one sacrificial formed Each has larger diameter than, essentially aligned with, in located (i) (ii) closer vias are filled with paste allowed cure harden. layer(s) is(are) removed expose bump.
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