High density connector and method of manufacture

摘要: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method manufacturing such connectors. There at least one recess the exterior side connector elements. A conductive contact extends from adjacent interior into housing. controlled volume solder paste introduced recess. fusible element, in form balls positioned The subjected to reflow process fuse ball portions extending said Contacts secured insulative housing deformable sections that minimize stress imposed central contacts promote uniformity volume.