Wiring substrate and process for manufacturing the same
作者： Hajime Saiki , Atsuhiko Sugimoto
DOI:
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摘要: A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the plated has phosphorus content of 8.5 to 15.0% by mass and is covered with gold layer.
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