MCM manufactured by using thin film multilevel interconnection technique
作者： Kenji Ito
DOI:
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摘要: The multichip module includes a ceramic multilayer substrate, thick film wiring, insulator, thin wiring portion and semiconductor chips. the insulator are laminated on substrate. is formed insulator. In this portion, wirings insulators alternately laminated. chips mounted of electrically connected to plurality bonding pads made portion. A situated underneath each pad, in order serve as part wiring.
lens.org 参考文章(4)
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