作者: Yusuf Kaygısız , Necmettin Maraşlı
DOI: 10.1016/J.JALLCOM.2017.06.027
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摘要: Abstract The effects of growth rates on the microstructure, microhardness, tensile strength, and electrical resistivity were studied in directionally solidified Al–Cu–Si–Mg (Al–28 wt%Cu–6wt.%Si–2.2 wt%Mg) quaternary eutectic alloy. directional solidification process was carried out at five different (V = 9.63–173.5 μm/s) a constant temperature gradient (G = 6.88 K/mm). microstructure alloy consists Al solid solution, irregular Si plates, intermetallic Al2Cu (θ) Cu2Mg8Si6Al5 (Q) phases with honeycomb morphology. dependencies lamellar spacing, found to be λ C u A l 2 = 19.05 V − 0.41 , M g 8 S i 6 5 51.28 0.43 8.74 0.46 H 170 . 7 + 79 08 0 25 237.68 ( ) 0.043 σ 343.45 0.15 ρ 3 42 × 10 0.10 respectively, for bulk also determined as 92.24 669.2 4205.5 μm3/s by using measured values plates alloy, respectively.