Method for making an article having an embedded electronic device
作者： Kevin Kwong-Tai Chung
DOI:
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摘要: A method for making an article having electronic device embedded therein comprises providing a substrate first and second opposing broad planar surfaces; mounting on the surface of substrate; applying layer melt-flowable adhesive substantially uniform thickness to cover device. The produced thereby has encapsulated by adhesive.
lens.org 参考文章(30)
Stephen Sydney Baird, Jr Louis Walter Broussard, Extruded epoxy packaging system ,(1973)
Yahya Haghiri-Tehrani, Data carrier having separately provided integrated circuit and induction coil ,(1997)
Franklin B. de Vall, Radio frequency identification transponder apparatus and method ,(1995)
Kazuyoshi Yoshida, Naoki Fujinami, Satoshi Odashima, Heat-sealable connector sheet ,(1993)
Jean-Pierre Gloton, Method for the manufacture of contact-free cards ,(1995)
Theodore W. Keller, Robert H. Bickley, John Bjornholt, Transponding tag and method ,(1993)
Frank Djennas, Bennett A. Joiner, Wilhelm Sterlin, Low profile semiconductor device with like-sized chip and mounting substrate ,(1994)
Yoshikazu Fukushima, Masao Gogami, Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module ,(1996)