Method of soldering materials supported on low-melting substrates

摘要: A method of soldering materials by controlling ultrasonic energy to effect melting only the solder in an assembly be joined that is carried on a low temperature substrate. The facilitates making electrical connections for completing electronic circuit unit supported substrate and comprises (a) positioning together first second conductive terminals said with deposit therebetween form assembly, at least one such being directly substrate; (b) gripping between motion generating horn anvil, while exciting apply vibration terminal provide sufficient shearing frictionally rubs surface rubbing direction generally parallel rapidly heat melt deposit; (c) essentially immediately upon completion deposit, ceasing application allow solidify soldered diffusion joint terminals.