Integrated electronic components and methods of formation thereof

作者: Jean-Marc Rollin , David W. Sherrer

DOI:

关键词:

摘要: Provided are integrated electronic components which include a waveguide microstructure formed by sequential build process and an device, methods of forming such components. The microstructures have particular applicability to devices for transmitting electromagnetic energy other signals.

参考文章(279)
Solomon Beilin, Michael G. Peters, Michael G. Lee, Wen-chou Vincent Wang, William T. Chou, Method of fabricating a substrate with a via connection ,(2001)
Roger Sinsheimer, Vladan Temer, Flex-circuit-based high speed transmission line ,(2003)
Toshihiro Miyake, Takashi Kamiya, Masashi Hori, Yoshio Hironaka, Taku Iida, Masashi Hiramatsu, Yasushi Matsumura, Hiroki Kamiya, Card edge connector and method of manufacturing the same ,(2008)
Jose Valenzuela, Timothy W. Harvey, Harry H. Porter, James D. Williams, Passive thermal control system ,(2003)
Philip J. Dambach, David L. Brunker, Richard A. Nelson, Slot transmission line patch connector ,(2004)
Arthur Zingher, George F. Walker, Spring array connector ,(1992)
Petrus Johannus Stephanus Teunisse, Transmission-line network ,(1995)
Igor Y. Khandros, Gaetan L. Mathieu, Alec Madsen, Gary W. Grube, Benjamin N. Eldridge, Sharpened, oriented contact tip structures ,(1999)