Process for treatment of materials with diode radiation

作者: Konrad Wissenbach , Eckhard Beyer , Volker Krause

DOI:

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摘要: The invention relates to a process for material treatment with diode radiation, especially laser radiation. To match the radiation profile process, is so carried out that emitted from multiplicity of diodes directed predetermined upon treated region workpiece and change in intensity distribution effected by controlling output power.

参考文章(11)
Megumi Ohmine, Masaharu Moriyasu, Seigo Hiramoto, Osamu Hamada, Takeshi Morita, Control apparatus for energy beam hardening ,(1987)
Kazuo Horikawa, Hideo Watanabe, Multiple laser beam scanner with beam intensity control ,(1985)
William E. Nothe, William E. Prifti, Christopher Ferguson, Joseph R. Adamski, Diode laser soldering system ,(1989)
Andreas G. Keipert, Michael S. Allen, Portable medical laser pack system ,(1993)
Herbert L Bernstein, Albert J Franco, Carl O Carlson, Semiconductor diode laser recorder ,(1969)
Jerzy Orkiszewski, H. Alfred Sklar, Andrej M. Listwan, Dynamic control of laser energy output ,(1991)
Yujiro Ito, Syunsuke Matsui, Takashi Otobe, Laser beam soldering apparatus and soldering method using the same ,(1988)