Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging

摘要: Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/ polycrystalline Cu interface during solid-state aging. The results show that the interfacial Cu6Sn5 grains exhibit textured under condition and their preferred orientations are affected by as-soldered joints. with [0001] direction normal to stable in solid molten Sn37Pb solder 200°C, but will be rapidly consumed 280°C, which leads formation different textures layer aging treatment joints 200°C 280°C. Also, effects texture evolution on IMCs evaluated. diffusion along is faster therefore more generated than those 280°C same reaction conditions.