Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices
作者： Andrzej Rybak , Karolina Gaska , Czeslaw Kapusta , François Toche , Vincent Salles
DOI: 10.1002/PAT.4038
关键词:
摘要: In this work, a novel core–shell material has been manufactured in order to enhance the thermal conductivity of epoxy-based composites. The polymer derived ceramics technique used produce fillers whose core is composed standard – silica, and outer layer consists boron nitride or silicon shell. synthesized filler was characterized by infrared spectroscopy, X-ray diffraction, scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. successful formation structure proven. Composite samples based on epoxy resin filled 31 vol% synthetized have investigated determine effective modified system. resulting composite exhibited improvements almost 30% relation systems, making them promising for heat management applications. Additionally, temperature dependence over broad range indicating that behavior incorporated stable. This stability crucial factor when considering potential using technology applications such as electronics power systems. Copyright © 2017 John Wiley & Sons, Ltd.
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sci-hub.se 参考文章(37)
Andrzej Rybak, Karolina Gaska, Functional composites with core–shell fillers: I. Particle synthesis and thermal conductivity measurements Journal of Materials Science. ,vol. 50, pp. 7779- 7789 ,(2015) , 10.1007/S10853-015-9349-6
Karolina Gaska, Andrzej Rybak, Czeslaw Kapusta, Robert Sekula, Artur Siwek, Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers Polymers for Advanced Technologies. ,vol. 26, pp. 26- 31 ,(2015) , 10.1002/PAT.3414
Dylan K. Smith, Michelle L. Pantoya, Effect of nanofiller shape on effective thermal conductivity of fluoropolymer composites Composites Science and Technology. ,vol. 118, pp. 251- 256 ,(2015) , 10.1016/J.COMPSCITECH.2015.09.010
C. P. Wong, Raja S. Bollampally, Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging Journal of Applied Polymer Science. ,vol. 74, pp. 3396- 3403 ,(1999) , 10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3
Ga-er Yu, Mohan J. Edirisinghe, Dudley S. Finch, Brian Ralph, John Parrick, Synthesis of α-silicon nitride powder from a polymeric precursor Journal of The European Ceramic Society. ,vol. 15, pp. 581- 590 ,(1995) , 10.1016/0955-2219(95)00011-I
Jiang Huang, Min Gao, Taisong Pan, Yin Zhang, Yuan Lin, Effective thermal conductivity of epoxy matrix filled with poly(ethyleneimine) functionalized carbon nanotubes Composites Science and Technology. ,vol. 95, pp. 16- 20 ,(2014) , 10.1016/J.COMPSCITECH.2014.02.008
Marcell Peuckert, Tilo Vaahs, Martin Brück, Ceramics from organometallic polymers Advanced Materials. ,vol. 2, pp. 398- 404 ,(1990) , 10.1002/ADMA.19900020903
Rajinder Pal, Thermal conductivity of three-component composites of core-shell particles Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 498, pp. 135- 141 ,(2008) , 10.1016/J.MSEA.2007.10.123
K W Garrett, H M Rosenberg, The thermal conductivity of epoxy-resin / powder composite materials Journal of Physics D. ,vol. 7, pp. 1247- 1258 ,(1974) , 10.1088/0022-3727/7/9/311
Liang Huang, Pengli Zhu, Gang Li, Daoqiang (Daniel) Lu, Rong Sun, Chingping Wong, Core–shell SiO2@RGO hybrids for epoxy composites with low percolation threshold and enhanced thermo-mechanical properties Journal of Materials Chemistry. ,vol. 2, pp. 18246- 18255 ,(2014) , 10.1039/C4TA03702B