Method of electroplating non-conductive plastic molded products
作者： Jun Okada , Hideki Shirota
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摘要: A method of electroplating non-conductive plastic moldings, the comprising steps of: applying a catalyst useful for electroless plating to moldings using colloidal solution containing precious metal compound and stannous compound; forming an electrically conductive coating on surface copper compound, saccharide having reducing property, complexing agent alkali hydroxide; coated moldings. According method, electroplated excellent in appearance properties can be formed by simple procedure.
lens.org 参考文章(23)
Joseph Soltys, Ammonia-free deposition of copper by disproportionation ,(1994)
William J. Amelio, Peter G. Bartolotta, Ralph E. Parsons, Voya Markovich, Electroless copper plating bath and improved stability ,(1985)
John Edward Mccaskie, Michael Thomas Boyle, Nayan Harsukhrai Joshi, Self accelerating and replenishing non-formaldehyde immersion coating method ,(1994)
Mikio Nishio, Shin Hashimoto, Akemi Kawaguchi, Masayuki Endo, Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device ,(1995)
Gary Kevin Lemon, William Howell Lawrence, Carlos Juan Sambucetti, Roy Harvey Magnuson, Robert William Johnson, Ralph Elliott Parsons, Voya Rista Markovich, Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon ,(1989)
Kiyoshi Okabayashi, Simplified method for direct electroplating of dielectric substrates ,(1991)
Saubestre E, Fadgen E, Activator solutions, their preparation and use in electroless plating of surfaces ,(1973)
Jeffrey Darken, Formaldehyde-free autocatalytic electroless copper plating ,(1985)
Walter R. Sommer, Electroless plating composition and method of use ,(1984)
Hidemi Nawafune, 秀美 縄舟, Takeshi Miura, Masaru Kiyota, 武之 三浦, 優 清田, Direct plating method by metallization of copper oxide (i) colloid ,(1993)