作者: Kenneth A. Kotyuk , Randall J. Diaz , Joerg U. Ferchau
DOI:
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摘要: An electronic assembly (2) includes an module (8) mountable to a backplane (4) having ground plane (48) for grounding and EMI shielding. The conductive chassis (10) floating board (12). Connector (18) is mounted the mates with connectors (20) on when engages backplane. Grounding clip (24) alignment pin (42) extending from laterally resilient arm (30) which grounds chassis. electrically connected (22) so that both planes are grounded through clip. pad (50) circumscribes plane. Conductive gasket (54) mechanically couples pad.