作者: François Droz
DOI:
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摘要: The present invention concerns a method of manufacture manufacturing card wherein there is supplied compressible positioning structure (6), at least one electronic element (8) and binder (12). positioned in manner such that it superposed onto the structure. In first case, (12) liquid form. another form solid sheet, which subsequently partially melted by applying energy. With help press, pressure applied to various elements as supplied. then penetrates (6) spreads out so coat (8). Finally obtained following solidification card.