Endoscope using a chip carrier type solid state imaging device
作者： Hisao Yabe , Teruo Eino
DOI:
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摘要: A solid state imaging device and a substrate to which this is fitted contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface substrate. The positions conductive parts, when that overlapped with device, retreated be within electrode so may small space.
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