Evaluation of the cross-plane thermal conductivity of double-layer materials
作者： Jong-Gu Kim , Dong-Hyun Bae , Byung-Dong Hahn , Young-Rae Cho
DOI: 10.1016/J.COMPOSITESB.2016.10.086
关键词:
摘要: Abstract Double-layer cladding materials were fabricated by roll bonding using stainless steel (STS439) and aluminum (Al1050) sheets to investigate the thermal conduction of multi-layer composites. The measured conductivities compared values calculated from cross-plane models that are widely used for resistor connections in electrical circuits. conductivity was 88.3 W/m·K sample containing 76 vol% Al1050. Unexpectedly, always higher than series model. high attributed contribution phonons transfer. A deviation index conductivity, Fm(S), is proposed, which effectively describes characteristics double-layer materials.
elsevier.com
sci-hub.se 参考文章(19)
T. Ishizaki, M. Yanase, A. Kuno, T. Satoh, M. Usui, F. Osawa, Y. Yamada, Thermal simulation of joints with high thermal conductivities for power electronic devices Microelectronics Reliability. ,vol. 55, pp. 1060- 1066 ,(2015) , 10.1016/J.MICROREL.2015.04.005
Hui Wang, Qing-Hua Qin, A new special coating/fiber element for analyzing effect of interface on thermal conductivity of composites Applied Mathematics and Computation. ,vol. 268, pp. 311- 321 ,(2015) , 10.1016/J.AMC.2015.06.077
A. Rape, K. Gott, A. Kulkarni, J. Singh, Simulation of matrix conductivity in copper–diamond composites sintered by field assisted sintering technology Computational Materials Science. ,vol. 110, pp. 29- 33 ,(2015) , 10.1016/J.COMMATSCI.2015.07.030
Heng-Chieh Chien, Da-Jeng Yao, Mei-Jiau Huang, Tien-Yao Chang, Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film Review of Scientific Instruments. ,vol. 79, pp. 054902- ,(2008) , 10.1063/1.2927253
H.-J. Rätzer-Scheibe, U. Schulz, T. Krell, The effect of coating thickness on the thermal conductivity of EB-PVD PYSZ thermal barrier coatings Surface & Coatings Technology. ,vol. 200, pp. 5636- 5644 ,(2006) , 10.1016/J.SURFCOAT.2005.07.109
C. L. Choy, K. W. Tong, H. K. Wong, W. P. Leung, Thermal conductivity of amorphous alloys above room temperature Journal of Applied Physics. ,vol. 70, pp. 4919- 4925 ,(1991) , 10.1063/1.349037
J.E. Lee, D.H. Bae, W.S. Chung, K.H. Kim, J.H. Lee, Y.R. Cho, Effects of annealing on the mechanical and interface properties of stainless steel/aluminum/copper clad-metal sheets Journal of Materials Processing Technology. ,vol. 187, pp. 546- 549 ,(2007) , 10.1016/J.JMATPROTEC.2006.11.121
Shoichi Kume, Ikuko Yamada, Koji Watari, Isao Harada, Kenshi Mitsuishi, High‐Thermal‐Conductivity AlN Filler for Polymer/Ceramics Composites Journal of the American Ceramic Society. ,vol. 92, ,(2009) , 10.1111/J.1551-2916.2008.02650.X
Lin Lu, Fu-Chi Wang, Zhuang Ma, Qun-Bo Fan, Anisotropic effect of splat interface on thermal conductivity of plasma sprayed YSZ coating Surface & Coatings Technology. ,vol. 235, pp. 596- 602 ,(2013) , 10.1016/J.SURFCOAT.2013.08.031
Arun Majumdar, Pramod Reddy, Role of electron–phonon coupling in thermal conductance of metal–nonmetal interfaces Applied Physics Letters. ,vol. 84, pp. 4768- 4770 ,(2004) , 10.1063/1.1758301