Conductive paste and multilayer printed wiring board using the same
作者： Noriki Hayashi , Hitoshi Takii , Yoshio Oka
DOI:
关键词:
摘要: The present invention provides a conductive paste comprising flake fillers having 99% cumulative particle size of 25 μm or less and binder resin as essential components. are metal particles silver-copper alloy surface layer. according to the is fused with part copper foil circuit which be connected during connection by heating pressurization, has high electrical conductivity fill ration in via hole. Thus, multilayer printed wiring board that reliability excellent interlayer connection.
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