Process for manufacturing printed circuits with an individual rigid conductive metallic support
作者： Bruno Gotkovsky , Louis Iliou
DOI:
关键词:
摘要: A process for manufacturing a printed circuit having conductive rigid metallic support that is well suited UHF use. engraved on one of two metallized surfaces substrate plate. After the formed, an epoxide adhesive film used to secure non-engraved surface support. The resulting assembly then machined.
lens.org 参考文章(9)
C Watson, J Lau, F Lee, O Abolafia, Electrical interconnect structuring for laminate assemblies and fabricating methods therefor ,(1972)
Louis B Allen, Sidney J Stein, David E Mcelroy, Metal to plastic laminated article and the method of making the same ,(1957)
Joseph M. Shaheen, Flexible conductor-resistor composite ,(1974)
Brian E. Bedard, Gary R. Geller, Method of tuning apparatus by low power laser beam removal ,(1979)
Richard W. Gehle, Method of assembly of microwave integrated circuits having a structurally continuous ground plane ,(1979)
Eric H. England, Methods of applying circuit elements to a substrate ,(1980)
Victor F Dahlgren, Sidney K Tally, Thomas H Stearns, Dimensionally stable flexible laminate and printed circuits made therefrom ,(1967)
Antier Guy, Guerin Gilbert, Masse électrique, notamment pour plaquettes de circuits imprimés ,(1965)
G. Robert Traut, Microwave circuit boards ,(1980)