The effect of submicron-sized initial tungsten powders on microstructure and properties of infiltrated W-25 wt.% Cu alloys
作者： Qiao Zhang , Shuhua Liang , Baoqiang Hou , Longchao Zhuo
DOI: 10.1016/J.IJRMHM.2016.05.014
关键词:
摘要: Abstract In the present work, several W-25 wt% Cu alloys have been prepared through combined processes of high-energy ball-milling, liquid-phase sintering and infiltration, using precursors industrial copper powders with an average particle size 50 μm tungsten alternative 8 μm, 800 nm, 600 nm or 400 nm. Microstructure characteristics, relative density, hardness electrical conductivity WCu were investigated to elucidate effect initial powders. EBSD was further utilized reveal orientation grain distribution in by 8 μm 400 nm-sized The results showed that alloy made exhibited excellent homogeneity for both sintered grains, together highest density 98.9%, 230 HB, good 48.7% IACS. Moreover, it also highly improved arc erosion mechanical wear resistances.
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