作者: David S. Nierescher , Loyd C. Moore , Alan W. Gray
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摘要: Modular socket technology is disclosed, which includes a contact board mounted to an electronic device for receiving voltage and current signals be transmitted from the semiconductor circuit. A compression coupler provided The printed circuit having plurality of conductors first side thereof, extending second thereof providing electrical between leads board. further resilient conductor adapted mechanically electrically engage coupler, thereby couple modular apparatus may include carrier elastic conducting pad engaging compress conductor, make mechanical so that device.