作者: James R. Mcelhanon , Edward M. Russick , David R. Wheeler , Douglas A. Loy , James H. Aubert
DOI: 10.1002/APP.10753
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摘要: We have successfully incorporated Diels–Alder reversible chemistry into epoxy resins. The goes in the forward direction at 60 °C and reverses or above 90 °C. One resin was formulated with other commercial ingredients foamed epoxy. foam, shown to mechanical properties similar foams formed conventional resins, is being utilized for electronic encapsulation. Because of built-in chemistry, can be easily removed by dissolution 1-butanol Removal allows rework, upgrading, dismantlement components. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1496–1502,