Thermodynamic Optimization of the Ag–Bi–Cu–Ni Quaternary System: Part I, Binary Subsystems

作者: Jian Wang , Senlin Cui , Weifeng Rao

DOI: 10.1007/S11664-018-6293-7

关键词:

摘要: A comprehensive literature review and thermodynamic optimization of the phase diagrams and thermodynamic properties of the Ag–Bi, Ag–Cu, Ag–Ni, Bi–Cu, and Bi–Ni binary systems …

参考文章(87)
Michael Hindler, Zhongnan Guo, Adolf Mikula, Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system. The Journal of Chemical Thermodynamics. ,vol. 55, pp. 102- 109 ,(2012) , 10.1016/J.JCT.2012.06.024
Hiroshi Ohtani, Kiyohito Ishida, Application of the CALPHAD method to material design Thermochimica Acta. ,vol. 314, pp. 69- 77 ,(1998) , 10.1016/S0040-6031(97)00457-7
P Feschotte, J.-M Rosset, Equilibres de phases dans le systeme binaire nickel-bismuth Journal of The Less Common Metals. ,vol. 143, pp. 31- 37 ,(1988) , 10.1016/0022-5088(88)90027-6
D. J. Chakrabarti, D. E. Laughlin, The Bi−Cu (Bismuth-Copper) System Bulletin of Alloy Phase Diagrams. ,vol. 5, pp. 148- 155 ,(1984) , 10.1007/BF02868951
Mohammad Mezbahul-Islam, Mamoun Medraj, Thermodynamic modeling of Cu–Ni–Y system coupled with key experiments Materials Chemistry and Physics. ,vol. 153, pp. 32- 47 ,(2015) , 10.1016/J.MATCHEMPHYS.2014.12.032
V WITUSIEWICZ, U HECHT, S FRIES, S REX, The Ag–Al–Cu system: Part I: Reassessment of the constituent binaries on the basis of new experimental data Journal of Alloys and Compounds. ,vol. 385, pp. 133- 143 ,(2004) , 10.1016/S0925-8388(04)00676-0
Jian Wang, Pierre Hudon, Dmytro Kevorkov, Patrice Chartrand, In-Ho Jung, Mamoun Medraj, Thermodynamic and Experimental Study of the Mg-Sn-Ag-In Quaternary System Journal of Phase Equilibria and Diffusion. ,vol. 35, pp. 284- 313 ,(2014) , 10.1007/S11669-014-0301-2
Xing Jun Liu, Feng Gao, Cui Ping Wang, Kiyohito Ishida, Thermodynamic assessments of the Ag-Ni binary and Ag-Cu-Ni ternary systems Journal of Electronic Materials. ,vol. 37, pp. 210- 217 ,(2008) , 10.1007/S11664-007-0315-1
U. Saeed, H. Flandorfer, H. Ipser, Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys Journal of Materials Research. ,vol. 22, pp. 3218- 3225 ,(2007) , 10.1557/JMR.2007.0401