Epoxy resin composition, coil cast product and semiconductor sealing device

摘要: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition free from halogen element such as fluorine, chlorine or bromine, excellent in reliability for flame retardancy, heat resistance, moldability, etc., and suitable coil casting semiconductor sealing use, the like. SOLUTION: This is one to essentially comprise (A) a element-free resin, (B) curing agent, (C) promoter, (D) inorganic filler, (E) aromatic condensed-type phosphoric ester of e.g. formula; wherein component E compounded at 3-30 pts.wt. based on 100 A main component.