Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods
作者： Thomas Bert Gorczyca , Richard Joseph Saia
DOI:
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摘要: Present embodiments are directed to an adhesive and method for assembling a chip package. The may be used couple substrate, the include epoxy-based dielectric material, epoxy resin, photoacid generator, antioxidant, cold catalyst corresponding generator.
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