Multilayer thin-film wiring board
作者： Kiyokazu Moriizumi , Naomi Fukunaga , Shunichi Kikuchi
DOI:
关键词:
摘要: A multilayer thin-film wiring board formed by laminating at least three layers including first, second, and third together with a dielectric layer. The first layer includes pattern having plurality of windows arranged the same pitch both in lateral direction longitudinal board, island patterns each located substantially central portion window. Similarly, second windows, are shifted from half direction. via pads on surface board. pad, pattern, one connected via.
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