Silicon Texturing Under Negative Potential Dissolution (NPD) Conditions
作者： Y. Ein-Eli , N. Gordon , D. Starosvetsky
DOI: 10.1016/B978-044452224-5/50041-X
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摘要: Abstract “As – cut” (111) oriented p-type silicon can be textured via NPD process at potentials below -10 V in KOH concentrations between 16 and 32% wt. The surface of is characterized with morphology arrayed pits the shape flat bottomed triangles. It was established that surface, as well a current-time profile recorded during texturing are strongly dependent on applied potential. Increase concentration negative shift potential significantly reduce time.
sci-hub.st 参考文章(28)
Xiaoge Gregory Zhang, Electrochemistry of silicon and its oxide ,(2001)
H. Seidel, L. Csepregi, A. Heuberger, H. Baumgärtel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions II . Influence of Dopants Journal of The Electrochemical Society. ,vol. 137, pp. 3626- 3632 ,(1990) , 10.1149/1.2086278
H. Seidel, L. Csepregi, A. Heuberger, H. Baumgärtel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions I . Orientation Dependence and Behavior of Passivation Layers Journal of The Electrochemical Society. ,vol. 137, pp. 3612- 3626 ,(1990) , 10.1149/1.2086277
Irena Zubel, Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si(100) anisotropic etching in KOH and KOH+IPA solutions Sensors and Actuators A-physical. ,vol. 84, pp. 116- 125 ,(2000) , 10.1016/S0924-4247(99)00347-7
Pierre Verlinden, Olivier Evrard, Emmanuel Mazy, André Crahay, The surface texturization of solar cells: A new method using V-grooves with controllable sidewall angles Solar Energy Materials and Solar Cells. ,vol. 26, pp. 71- 78 ,(1992) , 10.1016/0927-0248(92)90126-A
G Ensell, Free standing single-crystal silicon microstructures Journal of Micromechanics and Microengineering. ,vol. 5, pp. 1- 4 ,(1995) , 10.1088/0960-1317/5/1/001
J Qian, S Steegen, E Vander Poorten, D Reynaerts, H Van Brussel, EDM texturing of multicrystalline silicon wafer and EFG ribbon for solar cell application International Journal of Machine Tools and Manufacture. ,vol. 42, pp. 1657- 1664 ,(2002) , 10.1016/S0890-6955(02)00116-5
Jing Chen, Litian Liu, Zhijian Li, Zhimin Tan, Qianshao Jiang, Huajun Fang, Yang Xu, Yanxiang Liu, Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation Sensors and Actuators A-physical. ,vol. 96, pp. 152- 156 ,(2002) , 10.1016/S0924-4247(01)00786-5
E. van Veenendaal, K. Sato, M. Shikida, A.J. Nijdam, J. van Suchtelen, Micro-morphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH: velocity source forests Sensors and Actuators A-physical. ,vol. 93, pp. 232- 242 ,(2001) , 10.1016/S0924-4247(01)00653-7
R. M. Finne, D. L Klein, A Water‐Amine‐Complexing Agent System for Etching Silicon Journal of The Electrochemical Society. ,vol. 114, pp. 965- 970 ,(1967) , 10.1149/1.2426793