Sensor packages and method of packaging dies of various sizes
作者： Philip H. Bowles , Scott M. Hayes
DOI:
关键词:
摘要: A method ( 112 ) of forming a sensor panel 146 that includes an array 144 structures 22, 24 encapsulated in mold material 148 and controller 158 156 dies 26 160 ). The arrays 144, are arranged so locations the correspond with is bonded 162 to form stacked structure 164 After bonding, methodology entails 178 conductive elements 84 on ), removing 174 sections 126, 142, 168 from expose bond pads 42, 58 electrical interconnects 80 applying 182 packaging 90 singulating 196 produce packages 20, 104
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