Thermal interface materials with good reliability
作者： Sihai Chen , Ning-Cheng Lee
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摘要: A composition for a highly reliable thermal interface materials includes: (A) moisture-resistant polymer with water permeability coefficient preferably less than 10-11 cm3 (STP) cm/cm2 S Pa, (B) gas barrier having oxygen 10-14 (C) antioxidant, (D) conductive filler and ( E) other additive or optional materials. The placed in between the generating dissipating devices can effectively penetration, preventing fillers from degradation improving reliability of devices.
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