Monitoring Cure of Epoxy Resins Using a Microdielectrometer.

摘要: Abstract : Microdielectrometry is a recent advancement in monitoring the cure of resins using dielectric techniques. It utilizes solid state chip roughly .075 in. x as probe, and has on-chip amplification signal which permits interrogation material at frequencies low 1 Hz. This paper discusses utilizing microdielectrometry compares technique instrumentation to conventional dielectrometry. Data on an anhydride cured system aromatic amine under isothermal temperature variant conditions are presented. Results show that can be used follow epoxy resins. Absolute measurements permittivity loss factor made they provide information mechanisms produce observed changes. The present packaging unsuitable for use with composites.