Aqueous working fluid
作者： Tomohiko Kitamura , 友彦 北村
DOI:
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摘要: A water-soluble working fluid of the invention is used for cutting a brittle material using wire saw. The provided by blending water, alkylene oxide adduct acethylene glycol, and glycols. capable providing favorable accuracy when cut wire, thus suitable out large-diameter wafer. especially suitably applicable to an abrasive-grain-fixed
lens.org 参考文章(31)
Hiroaki Takahashi, Yasumasa Ohashi, Yasunori Numata, Shinji Hamamoto, Hiromichi Ishizuka, Water-soluble working fluid for fixed abrasive grain wire saw ,(2012)
Anja Kindling, Rudiger Landers, Torsten Henning, Silicone-free cutting oil and use thereof ,(2008)
Nevin Naguib, Steven Grumbine, Cutting fluid composition for wiresawing ,(2009)
Tomohiko Kitamura, Working fluid for brittle material and working fluid for hard material ,(2010)
Toru Mizusaki, Shuichiro Shinohara, Water-soluble surfactant composition ,(2004)
Tomohiko Kitamura, Aqueous processing liquid ,(2013)
John J. Gagliardi, Philip G. Clark, Patricia M. Savu, Naichao Li, Composition, method and process for polishing a wafer ,(2008)
Hiroaki Takahashi, Naoki Maruo, 宏明 高橋, Yasunari Numata, 康徳 沼田, 直樹 丸尾, Water-soluble working fluid for fixed-abrasive wire saw ,(2009)
Albert Pemwieser, Maximilian Kaeser, Walter Frank, Vernon Knepprath, Method for cutting wafers from a crystal ,(1997)
Hiroaki Takahashi, Yasunori Numata, Naoki Maruo, Aqueous processing solution for fixed abresive grain wire saw ,(2011)