Method for fabricating a chip scale package using wafer level processing

摘要: Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent regions defining individual die locations. Bond pads on the bumped with intermediate conductive elements, after which material used encapsulate is applied, filling channels and covering exposed peripheral edges integrated circuitry. The encapsulant then planarized expose ends bumps. External elements such as solder balls bump ends. wafer diced in alignment singulate devices, keeping circuitry substantially hermetically sealed.