Method and apparatus for routing die signals using external interconnects
作者： Charles David Paynter , Michael Brunolli , David Ian West , Vaishnav Srinivas , Bernie Jord Yang
DOI:
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摘要: Various aspects of an approach for routing die signals in interior portion a using external interconnects are described herein. The provides contacts coupled to circuits the die, where exposed exterior die. configured couple these so that from may be routed externally In various disclosed approach, protected by packaging
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