Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands

摘要: Gold nanoparticles are formed to cover the surface of sulfonated-polystyrene (PS) beads by in-situ ion-exchange and chemical reduction a stable cationic gold ligand, which makes it different from physical adsorption or multiple electroless metallization methods. PS synthesized dispersion polymerization with diameter 2.7 μm, their is modified introducing sulfonic acid groups (SO - 3 ) give an ion exchange capacity up 2.25 mequiv. g -1 , provides 1.289 x 10 SO per bead. Subsequently, anionic incorporated dichlorophenanthrolinegold(III) chloride ([AuCl 2 (phen)]Cl), through electrostatic interaction in liquid phase (ca. 1-4 nm diameter) on PSo surface. Assuming that approximately three interact one [Aucl (phen)] + process, coverage bead estimated as 12.0 wt.-%, compares well 16.8 wt.-% loading measured inductively coupled plasma-mass spectrometry. Because adjustable IEC values polymer Au presence S atoms, both soft nature, developed methodology could provide simple controllable route synthesize robust metal coating