Encapsulation for an organic electronics component and production method therefor

摘要: The invention relates to an encapsulation for organic electronics component, particularly OLED, which can be produced by simple coating methods or printing and still has a high degree of tightness with regard environmental influences that are detrimental the component. This is made possible use so-called fusible alloys, i.e. low-melting point metallic alloys combine low melting from moisture oxidizing gases.