Self-compensating hydrostatic flattening of semiconductor substrates

摘要: A semiconductive substrate (1), such as a silicon wafer, is mounted on baseplate (3), for inclusion in an optical device liquid crystal light valve. An flat (9) presses the top surface of wafer toward and against ring seal (5) surrounding fluid adhesive (7). The hydrostatically distributes force compression to guarantee flatness self-compensation amount surrounded by O-ring. semiconductor limited only which it compressed. Parallel alignment (9), (1) (3) achieved reflecting laser beam (20) through observing interference fringes therein, while adjusting relative so maximize distance between fringes.