Domain Decomposition Methods in Electrothermomechanical Coupling Problems

作者: Ronald H.W. Hoppe , Yuri Iliash , Siegfried Ramminger , Gerhard Wachutka

DOI: 10.1007/3-540-26825-1_39

关键词:

摘要: In this contribution, we are concerned with electrothermomechanical coupling problems as they arise in the modeling and simulation of high power electronic devices. particular, faced a hierarchy coupled physical effects so far electrical energy is converted to Joule heat causing stresses that have an impact on mechanical behavior devices may lead damage. Moreover, there structural due sandwich-like construction featuring multiple layers specific materials different thermal properties. The latter motivates application domain decomposition techniques nonmatching grids based individual finite element discretizations substructures. We will address detail aspects phenomena well discretization-related couplings numerical operating

参考文章(5)
Y. Vassilevski, Y. Iliash, B. Wohlmuth, R. Hoppe, Y. Kuznetsov, Analysis and parallel implementation of adaptive mortar element methods East-West Journal of Mathematics. ,vol. 6, pp. 223- 248 ,(1998)
S. Ramminger, N. Seliger, G. Wachutka, Reliability model for Al wire bonds subjected to heel crack failures Microelectronics Reliability. ,vol. 40, pp. 1521- 1525 ,(2000) , 10.1016/S0026-2714(00)00139-6
Ronald H. W. Hoppe, Barbara Wohlmuth, Adaptive Multilevel Techniques for Mixed Finite Element Discretizations of Elliptic Boundary Value Problems SIAM Journal on Numerical Analysis. ,vol. 34, pp. 1658- 1681 ,(1997) , 10.1137/S0036142994276992
Franco Brezzi, Luisa Donatella Marini, Paola Pietra, Numerical simulation of semiconductor devices Computer Methods in Applied Mechanics and Engineering. ,vol. 75, pp. 493- 514 ,(1989) , 10.1016/0045-7825(89)90044-3
Viggo Tvergaard, Material Failure by Void Growth to Coalescence Advances in Applied Mechanics. ,vol. 27, pp. 83- 151 ,(1989) , 10.1016/S0065-2156(08)70195-9