作者: Ronald H.W. Hoppe , Yuri Iliash , Siegfried Ramminger , Gerhard Wachutka
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摘要: In this contribution, we are concerned with electrothermomechanical coupling problems as they arise in the modeling and simulation of high power electronic devices. particular, faced a hierarchy coupled physical effects so far electrical energy is converted to Joule heat causing stresses that have an impact on mechanical behavior devices may lead damage. Moreover, there structural due sandwich-like construction featuring multiple layers specific materials different thermal properties. The latter motivates application domain decomposition techniques nonmatching grids based individual finite element discretizations substructures. We will address detail aspects phenomena well discretization-related couplings numerical operating