Batch chip placement system

摘要: A batch chip placement system for positioning semiconductor chips, or the like, upon a substrate containing an array of sites footprints whose actual position on deviates from theoretical nominal over successive substrates. The is achieved by first sensing X and Y offsets pair alignment marks their to determine ΔX ΔY correction factors required obtain X,Y marks. used values, θ rotation shrinkage factor corrections proper orientation placement.