Bonded wafer processing method
作者： Michael Y. Chan , Patrick Morrow , R. Scott List
DOI:
关键词:
摘要: According to one embodiment a method is disclosed. The includes applying photoresist layer first wafer, etching the bonding wafer second and thinning wafer; wherein an unsupported bevel portion of removed.
google.de 参考文章(3)
Emil Baran, Mark L. Mastroianni, Robert A. Craven, Subramanian S. Iyer, Single-etch stop process for the manufacture of silicon-on-insulator wafers ,(1996)
William Andrew Nevin, Graeme Peters, Cormac John MacNamara, Composite semiconductor wafer and a method for forming the composite semiconductor wafer ,(2003)
Etsuro Morita, Toru Taniguchi, 悦郎 森田, 徹 谷口, Production of pasted board ,(1997)