Polymer interconnect structure

摘要: A conductive polymer interconnect structure (10) is comprised of an insulative (18), a silicone or epoxy, having plurality particles (20) arranged therein to provide paths which extend in the z direction. At least portion those proximate separate one major surfaces matrix has at thereof coated with solder 24 whose composition tailored melt below cure temperature (18). In this way, when (18) sandwiched between pair members (12 and 14) cured, metallurgical bond, rather than mechanical will be formed members.