Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board
作者： Chiaki Takubo , Yoshizumi Sato , Tomitsugu Kojima , Go Takeda
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摘要: A first via land of a wiring layer on surface insulation that is rigid and second flexible are electrically mechanically connected with conductive pillar pierced through third disposed between the layer. In such structure, board can mount highly integrated semiconductor device, small thin, has high reliability be accomplished.
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