Frequency selective grounding method and arrangement

摘要: A grounding arrangement (19) for a communication product (10) can include an external conductive surface (12), internal ground (50), and frequency selective path between the ground. The (54 and/or 56) provides high impedance signals at predetermined operating range low inductance electrostatic frequencies. reside on of printed circuit board (18) within be coupled to via spring contact (20) inductor (54) or resonant 56).