作者: Richard H. Winings
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摘要: PLanar articles such as silicon wafers 40 are removably mounted onto a flat microcellular polyurethane surface layer 48 of carrier 30 to permit an exposed 42 each wafer be polished. To retain the against lateral polishing forces on is treated with dilute organic acid prior mounting 40. The treatment involves contacting selected from group consisting citric, propionic, formic and acetic acids. thoroughly wetted after which all excess scraped surface. then manually placed upon while it still wet.