Enhanced heat sink attachment

摘要: A slug or plate of copper some other material having high heat conductivity is attached by an adhesive such as epoxy to a heat-emitting electrical component chip, ASIC, microprocessor, the like. sink base and plurality fins upstanding from screws, nuts other, preferably detachable, means. The bottom may be formed with socket receive slug. larger than slug, thereby improving dissipation. When it necessary replace component, detached re-used.