Thermal denervation of an intervertebral disc for relief of back pain

摘要: This continuation-in-part patent application follows the original parent which described a general method of denervation nerves in and around intervertebral disc to relieve back pain using heating from probe is inserted within disc. The can be connected power source deliver energy disc, thereby denervating associated with consequent relief various kinds discogenic pain. illustrates other embodiments invention application. In particular, it describes methods denervate as well thermal cooling or cryogenic These either percutaneous carried out during open interoperative intervention Furthermore, we describe this an embodiment impedance-detecting probes shafts were generically impedance measuring devices help ascertaining when proper position make lesion.