Method of forming multilayer capacitors in a printed circuit substrate
作者： John M. Lauffer , Rabindra N. Das , How T. Lin , Frank D. Egitto , Voya R. Markovich
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摘要: Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The may be preformed using etching deposition techniques. A photoimageable is an upper surface the laminate. Exposing and exposes space between traces. These spaces then filled with capacitor material. Finally, either laminated deposited atop structure. This layer etched to provide electrical interconnections elements. Traces height meet plane defining substrate thin traces remaining secondary plating process utilized raise
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