Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

摘要: Systems and methods may provide for a device including housing, one or more electronic components positioned within the first cured resin composition thermal energy storage material filler material. The also include second be different, wherein encompass at least of components. In other examples, power supply complies with an ATEX equipment directive explosive atmospheres. Moreover, component underfill and/or assembly overmold processes used to fabricate device.