Fine pitch solder deposits on printed circuit board process and product

摘要: A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select contacts a printed circuit board. The method particularly suited to the fabrication populated board having fine pitch devices including flip-chip devices, connected conventional coarse surface mounted components. are exposed through holes in stencil characterized its ability withstand temperatures, not be wettable solder, have coefficient thermal expansion relatively matching Low temperature paste screen deposited into openings. With fixedly positioned board, retained pattern reflowed selectively form underlying Thereafter, according preferred practice invention, removed from subject previously practiced depositions flux preparation component placement ensuing reflow. Alternate practices invention involve concurrent deposition retention following fellow.