Method of manufacturing an electronic component and electronic component obtained by means of said method
作者： Roelf Anco Jacob Groenhuis , Peter Wilhelmus Maria Van De Water , Johan Bosman
DOI:
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摘要: The invention relates to a method of manufacturing an electronic component (1), in particular semiconductor which is provided with electric connection regions (2), wherein mark (M), such as type number, on surface thereof by means laser radiation (3). In according the invention, (1) attached one (4) its sides (4, 7) foil (5) adhesive layer (6), and provided, said side (4), (M) through (6). this manner, large number components can be readily without undue handling, marking operation integrated complete process components. Surprisingly it has been found that radiation-absorbing double (5, 6) very well feasible. (6) contact between region (2) layer. Preferably, are manufactured simultaneously within single body (10) (5). After provision separated from each other.
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