作者: Nirajkumar Patel
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摘要: Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and do not suffer from as significant decrease in impact strength would result the introduction generic fibers are achieved using treated with polyamide terpolymer binder. The bundles dispersed within blend. can be used for injection molding articles use components applications requiring static dissipation and/or EMI shielding. Such include, but limited to electronic devices, dust handling equipment notebook computer enclosures.